A Long-Rumored Chip Makes a Quiet Appearance
A mysterious and long-rumored processor from AMD has finally made a tangible appearance. New data from customs shipping manifests has revealed the existence of an AMD APU (Accelerated Processing Unit) codenamed “Sound Wave.” This leak is causing a stir because, if previous rumors are correct, “Sound Wave” could mark AMD’s grand return to non-x86 architectures, potentially building a chip based on ARM technology for the first time in over a decade.
The information, shared by leaker @Olrak29_, lists the chip under an internal AMD designation and provides key physical specifications. This concrete data moves “Sound Wave” from the realm of pure speculation to a tangible product in development, giving us our first real look at what AMD might be planning for the future of mobile computing.
Designed for a Portable, Efficient Future
The leaked details point squarely to a chip designed for compact, power-efficient devices. The listing confirms “Sound Wave” uses a BGA-1074 package measuring 32 x 27 mm. This small size is a standard for mobile System-on-Chips (SoCs) and is ideal for products like ultra-thin laptops, tablets, and handheld gaming devices.
Furthermore, the chip is reported to adopt the newer FF5 interface, which replaces the older FF3 connector found in devices like the popular Steam Deck handheld. This update suggests “Sound Wave” is being built with modern, compact device manufacturing in mind. Most tellingly, the chip is rumored to target a very low power range, below 10W, positioning it as a perfect candidate for the burgeoning “Windows on ARM” market, which prioritizes long battery life and always-connected cellular capabilities.
Soundwave – SWV
— Gray (@Olrak29_) October 12, 2025
BGA1074
32mm x 27mm pic.twitter.com/lcArm96nCy
The ARM Question and the Competitive Landscape
The most exciting aspect of the “Sound Wave” leak is its potential architecture. While AMD has built its empire on x86 chips that power most Windows PCs, a move to ARM would be a significant strategic shift. ARM-based chips, like those from Apple and Qualcomm, are known for their exceptional power efficiency, allowing for sleeker device designs without sacrificing battery life.
Earlier rumors suggest “Sound Wave” could feature a 6-core design with 2 high-performance cores and 4 efficiency cores. It is also said to integrate graphics based on AMD’s own RDNA 3.5 architecture. This combination would create a balanced chip capable of handling everyday tasks and light gaming with minimal power draw.
However, this proposed configuration indicates “Sound Wave” may not be a direct competitor to the raw power of Qualcomm’s recently announced Snapdragon X Elite series, which boasts up to 12 high-performance cores. Instead, AMD seems to be targeting a different segment of the market, perhaps focusing on maximum efficiency and affordability.
What It Means for Your Next Laptop
While AMD has not officially announced “Sound Wave,” the leaks suggest it could appear in devices as early as next year. It has been previously speculated that this chip could be destined for a future Microsoft Surface device, as Microsoft is a key partner in the Windows on ARM ecosystem.
Also, Read
- AMD & Sony Reveal Next-Gen GPU Tech – Radiance Cores, Neural Arrays & Universal Compression
- AMD Launches Radeon RX 7700 with 16GB Memory, Filling Gap in RDNA 3 Lineup
- AMD Extends AM4 Platform to 9 Years with New Ryzen 5 5600F CPU Launch
For consumers, the emergence of a competitive AMD ARM chip would be excellent news. It would provide more choice and likely drive innovation in the laptop market, leading to a wider variety of thin, light, and long-lasting devices. The “Sound Wave” may not be making much noise yet, but its ripple effects could soon be felt across the entire PC industry.