The veil has been lifted on AMD’s next gaming-centric processor. Following its official announcement at CES 2026, the first close-up photographs of the Ryzen 7 9850X3D have been published by hardware outlets, giving us an unprecedented look at the physical chip and confirming a major architectural change designed for better performance and cooling.
These images, sourced from what appears to be an OEM sample, move beyond official renders to show the actual layout of the silicon that will drive next-generation gaming PCs.
A Clear View of the Chip Layout
The photos, published by PC Games Hardware and Club386, show the AM5 package with its integrated heat spreader (IHS) both on and off. The images clearly reveal the expected configuration for an 8-core model: a single Zen 5 Compute Core Die (CCD) positioned below the central I/O Die.
This visual confirmation dispels any speculation from earlier generic imagery that suggested a two-CCD design. The visible layout aligns perfectly with the specs of an 8-core, 16-thread processor focused on delivering maximum gaming speed through its stacked cache, not additional cores.
The Big Innovation: Flipped 3D V-Cache for Better Cooling
The photos also provide tangible evidence of the most important technical evolution for the Ryzen 9000X3D series. As reiterated by the reporters, AMD has flipped the design of its 3D V-Cache.
Here it is – AMD Ryzen 7 9850X3D in the flesh at CES 2026!#amd #CES2026 pic.twitter.com/AWbsYImf9z
— Club386 (@theclub386) January 7, 2026
In previous X3D processors, the additional cache sat on top of the CPU cores. In this new generation, the cache is positioned below the cores. This fundamental change in the vertical stacking order is engineered to improve thermal transfer. With the cores now in direct contact with the heat spreader, heat can be dissipated more efficiently, which is the key enabler for the chip’s higher 5.6 GHz boost clock compared to its predecessor.
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Manufacturing Details and Expected Launch
The close-up shots also reveal the chip’s manufacturing label. The sample is marked as being from week 37 of 2025, produced in Malaysia. This timeline is consistent with a product ramping up for a Q1 2026 launch, with some industry whispers pointing to a February availability.
These leaked photos serve as concrete proof of progress, moving the Ryzen 7 9850X3D from a announced specification sheet to a tangible product nearing its release. For gamers and PC builders anticipating this CPU, the images validate AMD’s design direction and build excitement for what promises to be a standout processor for high-frame-rate gaming.
Source: pcgameshardware