Intel’s 52-Core “Core X” HEDT Nova Lake-S Rumored to Require New Socket and High-Power Motherboards
The high-end desktop (HEDT) segment, long dominated by AMD’s Threadripper, may soon see the return of a familiar face. According to fresh leaks from reputable sources, Intel is preparing a new “Core X” series based on its upcoming Nova Lake-S architecture. These chips are rumored to feature dual compute tiles, core counts reaching as high as 52 cores, and power demands significant enough that not all motherboards will be able to support them.
The leaker, known as Jaykihn, has shifted the conversation away from speculative turbo power figures and toward platform requirements. The key takeaway? These dual-tile variants are not intended as direct successors to the Core Ultra 9 285K. Instead, they appear targeted at a revived HEDT segment—one that would sit above mainstream desktop parts and potentially carry the Core X branding, harkening back to Intel’s Skylake-X and Cascade Lake-X era.
A New Socket: LGA-1954
Perhaps the most significant implication of these rumors is the platform change. High core counts and elevated power draw necessitate more pins for power delivery and I/O. The leaks point to a new LGA-1954 socket for these HEDT parts, separating them physically from the mainstream LGA-1851 platform expected for standard Core Ultra desktop chips.
This means users eyeing a 52-core Nova Lake-S processor will likely need a new motherboard built specifically for the HEDT lineup. This is a familiar strategy for Intel, which historically reserved different sockets for its enthusiast-grade silicon. The move also gives motherboard manufacturers room to innovate on VRM designs and cooling solutions to handle the increased thermal and electrical demands.
Power Requirements: 175W Base and Beyond
While earlier leaks floating specific PL2 (turbo) figures have been dismissed as outdated and unconfirmed by Intel, the leaker has stood by one number: the PL1 (Base Power) of 175W for the dual-tile variants. This is a confirmed figure for the 52-core and 42-core SKUs in the leaked table.
A 175W base power is substantial. It suggests that under full load, these chips will run hot and heavy, requiring robust cooling and motherboard power delivery. For context, this base power alone rivals the all-core turbo power of many mainstream processors. The actual turbo power (PL2) remains unconfirmed, but it will almost certainly be higher, potentially pushing toward 300W or more under maximum load. This explains why motherboard support will be segmented—lower-end Z990 boards may not have the VRM overhead to safely run these HEDT chips.
Dual-Tile and Single-Tile Strategy
Importantly, the rumors clarify that Intel is not abandoning the single-tile variants. The plan reportedly includes:
- Dual-Tile Variants (HEDT/Core X Series): Featuring up to 52 cores (16 P-cores + 32 E-cores + 4 LP cores) and 288MB of bLLC (Big Last Level Cache). These require the new LGA-1954 platform.
- Single-Tile Variants (Mainstream/Core Ultra Series): Featuring up to 28 cores (8 P-cores + 16 E-cores + 4 LP cores) and 144MB of bLLC. These are expected to use the existing or slightly evolved mainstream socket.
This dual-pronged approach allows Intel to compete simultaneously in the volume desktop market with the single-tile chips while taking direct aim at AMD’s Threadripper with the dual-tile HEDT parts.
Core X Branding Returns
The revival of the “Core X” branding is a nod to enthusiasts who remember the days of 18-core i9-7980XE and 56-core Xeon W-3175X. While the name is not yet finalized—Intel could also use the “X” suffix for bLLC variants on the mainstream side—the historical tiering makes Core X a logical choice for the halo HEDT products. It also aligns with the naming scheme used for Intel’s top-tier mobile Panther Lake chips, suggesting a cohesive brand hierarchy.
Market Positioning
If these rumors hold, Intel is positioning the Core X series as a premium option that does not require a full platform leap to workstation-grade silicon. By keeping these chips on a consumer-oriented chipset (likely a high-end variant of Z990), Intel could offer HEDT performance without forcing users into the expensive Xeon or Threadripper ecosystems. Pricing would naturally be premium, but the barrier to entry would be lower than competing workstation platforms.
Also, Read
- Intel’s Core Ultra 400 Nova Lake Leak Reveals Massive 150mm² CPU Tile to Battle AMD’s 3D V-Cache
- Intel’s Core Ultra 9 290K Plus Leaks Again, Now Showing 10% Higher Performance
- Intel’s Next-Gen CPU Leak – Nova Lake-S “K” Chip May Consume Over 700 Watts
The Caveat
As with all pre-release information, these details remain unconfirmed by Intel. Roadmaps change, specifications are refined, and final products may differ significantly from current leaks. However, the consistency of information emerging from multiple sources suggests Intel is indeed plotting a return to the HEDT space—one that could reignite competition at the very top of the desktop performance ladder.
Source: Jaykihn